Glass through-hole processing using sandblasting and wet etching methods.
We can also create wiring patterns for both sides of the glass and multilayer wiring, so please feel free to consult with us!
We offer a "glass through-hole processing service using sandblasting + wet etching methods." We accommodate thin to thick metal films such as ITO / Cr / Ti / Al / Au / Ag / Cu / Ni / Mo alloys. We can also create wiring patterns and multilayer wiring on both sides of the glass, so please feel free to consult with us. 【Substrate Details】 ■ Alkali-free glass ■ φ12 inches × 0.3 mm thick ■ Aperture diameter: φ150 μm ■ Pitch: 300 μm ■ Number of holes: 700,000 ■ Metal film: 8,000 Å *For more details, please refer to the PDF document or feel free to contact us.
- Company：KISO WAVE
- Price：Other
